Lin, Chi-Pu: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations

Chi-Pu Lin, Chih-Ming Chen

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.06 MB

english, 2012

2

Morphological Evolution of the Reaction Product at the Sn-9wt.%Zn/Thin-Film Cu Interface

Chih-Ming Chen, Chih-Hao Chen, Chi-Pu Lin, Wen-Chiung Su

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 535 KB

english, 2008

3

Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow

Chih-hao Chen, Chi-pu Lin, Chih-ming Chen

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 1013 KB

english, 2009

4

Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board

Chi-pu Lin, Chih-ming Chen

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 828 KB

english, 2009

5

Effect of temperature on microstructural changes of the Sn–9 wt.% Zn lead-free solder stripe under current stressing

Chih-ming Chen, Yu-min Hung, Chi-pu Lin, Wen-Chiung Su

Journal:

Materials Chemistry and Physics

Year:

2009

Language:

english

File:

PDF, 1.09 MB

english, 2009

6

Microstructural evolution of the Au–20 wt.% Sn solder on the Cu substrate during reflow

Hsang-mou Chung, Chih-ming Chen, Chi-pu Lin, Chia-ju Chen

Journal:

Journal of Alloys and Compounds

Year:

2009

Language:

english

File:

PDF, 1.90 MB

english, 2009

7

Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrate

Chi-Pu Lin, Chih-Ming Chen, Ching-Hsuan Lin, Wen-Chiung Su

Journal:

Journal of Alloys and Compounds

Year:

2010

Language:

english

File:

PDF, 600 KB

english, 2010

8

Interfacial reactions between high-Pb solders and Ag

Chi-Pu Lin, Chih-Ming Chen, Yee-Wen Yen, Hsin-Jay Wu, Sinn-Wen Chen

Journal:

Journal of Alloys and Compounds

Year:

2011

Language:

english

File:

PDF, 2.04 MB

english, 2011

9

The cross-interactions in the Ni/Sn/Cu diffusion couples with an electroless palladium surface finish

Chi-Pu Lin, Chih-Ming Chen

Journal:

Journal of Alloys and Compounds

Year:

2013

Language:

english

File:

PDF, 1.33 MB

english, 2013

10

Interfacial Reaction of Molten Sn on a Strained Cu Electroplated Layer

Hsiao-An Pan, Chi-Pu Lin, Chih-Ming Chen

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 1.10 MB

english, 2012

11

Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain

Lin, Chi-Pu, Chen, Chih-Ming, Yen, Yee-Wen

Journal:

Journal of Alloys and Compounds

Year:

2014

Language:

english

File:

PDF, 2.69 MB

english, 2014

12

Editorial Board

Lin, Chi-Pu, Chen, Chih-Ming, Yen, Yee-Wen

Journal:

Le Pharmacien Hospitalier

Year:

2010

Language:

french

File:

PDF, 57 KB

french, 2010

13

Retardation of the Cu5Zn8Phase Fracture and Improvement of Shear Strength of the Sn-9

Po-Hsun Lee,Chi-Pu Lin,Chih-Ming Chen

Journal:

Metallurgical and Materials Transactions A

Year:

2013

Language:

english

File:

PDF, 726 KB

english, 2013

14

Analytical and numerical study of curved-base rocking walls

Lin, Chi-Pu, Wiebe, Richard, Berman, Jeffrey W.

Journal:

Engineering Structures

Year:

2019

Language:

english

File:

PDF, 5.33 MB

english, 2019

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@z-lib.do

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски